電氣性能 (Electrical Performance)
|
測試項目 (Testing Items)
|
測試參考文件 (Reference Document)
|
A1.接觸電阻(LLCR,Contact Resistance)
|
EIA-364-23
|
A2.絕緣阻抗(Insulation Resistance)
|
EIA-364-21
|
A3.耐電壓測試(Dielectric Withstand Voltage)
|
EIA-364-20, Test method B
|
A4.額定電流測試(Current Rating)
|
EIA-364-70, Test method 1
|
機械/機構性能 (Mechanical Performance)
|
測試項目 (Testing Items)
|
測試參考文件 (Reference Document)
|
B1.保持力(Contact Retention)
|
EIA-364-29,Test method B
|
B2.耐久測試(Durability)
|
EIA-364-09
|
B3.彈簧力測試(Spring Force)
|
EIA-364-04(Normal Force Test Procedure)
|
B4.振動測試 Random Vibration
|
EIA-364-28,Test condition II,
|
B5.機械衝擊測試 Mechanical Shock
|
EIA-364-27,Test condition A
|
環境測試性能 (Environmental Testing)
|
測試項目 (Testing Items)
|
測試參考文件 (Reference Document)
|
C1.高濕測試 Humidity
|
EIA-364-31,Test method II, Condition A
|
C2.鹽霧噴水測試 Salt Spray
|
EIA-364-26,Test condition B
|
C3.熱靜置測試(Temperature Life)
|
EIA-364-17,Test method A,condition 4,Test time condition A
|
C4.冷熱衝擊測試 Thermal Shock (Cycling)
|
EIA-364-32, Test condition VIII
|
C5.耐銲錫熱測試(Resistance to Solder Heat)
|
EIA-364-56,Procedure 5,Level 2
|
其他 (Others)
|
測試項目 (Testing Items)
|
測試參考文件 (Reference Document)
|
D1.包裝掉落測試(Drop Test)
|
Refer to Drop Test Standard of Molex
|
D2.側向力測試(Side Force) /焊錫強度測試
|
Refer to Side Force Standard of BENQ
|
D3.沾錫能力 Solder ability
|
EIA-364-52
|
|